| Continuity (open-circuit) test | Whether specified conductive paths connect their intended test points. | Broken traces, incomplete plating, cracked connections, or disconnected vias. | Fabricated bare boards; also used for selected checks on assembled boards. | Pass/fail against the netlist and the test program’s defined limits. | Finds interrupted connections before a board is assembled or put into service. |
| Isolation (short-circuit) test | Whether electrically separate nets remain isolated from one another. | Copper shorts, conductive debris, unintended bridges, or spacing-related defects. | Fabricated bare boards, commonly paired with continuity testing. | Insulation resistance or leakage current compared with specified acceptance limits. | Helps prevent unintended current paths that can cause malfunction or damage. |
| Flying-probe electrical test | Continuity and isolation at selected points using movable probes. | Opens and shorts on boards without a dedicated fixture. | Prototypes, low-volume production, and designs that change frequently. | Test-point measurements evaluated against the board’s netlist. | Allows electrical verification with flexible setup and no custom bed-of-nails fixture. |
| Fixture-based (bed-of-nails) test | Continuity and isolation across many accessible points using a board-specific probe fixture. | Opens, shorts, and other netlist mismatches detectable at the fixture’s contact points. | Repeated production runs where a dedicated fixture is practical. | Automated pass/fail results compared with the programmed netlist and limits. | Can test many points quickly and consistently once the fixture is set up. |
| Insulation-resistance test | Resistance between conductors intended to be electrically isolated. | Unwanted leakage paths caused by contamination, material issues, or manufacturing defects. | When required by the product specification, applicable standard, or reliability plan. | Resistance measured at a specified test voltage and under defined conditions. | Provides information about isolation quality beyond a simple continuity check. |
| High-potential (hi-pot) test | Whether insulation withstands a specified voltage between selected conductors. | Insulation breakdown or excessive leakage under the defined test conditions. | Boards or assemblies for which the design or safety requirements call for it. | Pass/fail based on the specified voltage, duration, and leakage-current limit. | Checks voltage withstand capability; test conditions must suit the design and components. |
| Power-on and functional test | Whether an assembled PCB operates as intended when powered and exercised. | Assembly faults, incorrect component placement, wiring errors, or functional failures. | PCB assembly and product-level manufacturing, rather than bare-board fabrication alone. | Measured signals, outputs, and operating behavior compared with defined criteria. | Confirms operation that bare-board continuity and isolation tests cannot establish. |
| Test-program and netlist validation | Whether the electrical test setup represents the correct design revision and intended connections. | Misconfigured test limits, incorrect net assignments, or revision mismatches. | Before production testing and when design data or test programs change. | Documented comparison of test data, netlist, revision, and approved limits. | Reduces the risk of false failures or undetected defects caused by an incorrect test setup. |
| Important: Test voltage, duration, resistance or leakage limits, test coverage, and acceptance criteria depend on the board design, materials, product requirements, and applicable standards. They should be defined in the approved test specification rather than assumed to be universal values. |