| Polyimide Adhesive | Approximately 200–300°C, depending on formulation, cure schedule, and exposure time | Approximately 350–400°C for limited-duration exposure | Metals, glass, ceramics, polyimide films, and selected high-temperature composites | Excellent thermal stability, low outgassing, strong electrical insulation, and good resistance to radiation and many chemicals | Often requires elevated-temperature curing; relatively high cost; bond strength may decline after prolonged exposure near the upper temperature limit | Aerospace components, flexible circuit bonding, high-temperature wire insulation, sensors, and electronic assemblies |
| Ceramic Adhesive / Inorganic Ceramic Cement | Approximately 500–1,000°C, depending on chemistry and joint design | Some formulations tolerate approximately 1,200–1,500°C under controlled conditions | Ceramics, glass, graphite, refractory metals, and some oxidized metal surfaces | Exceptional temperature resistance, low flammability, low organic content, and strong resistance to oxidation and solvents | Brittle after curing; limited resistance to vibration, impact, and differential thermal expansion; surfaces must be clean and properly prepared | Furnace components, thermocouples, heating elements, refractory assemblies, exhaust systems, and high-temperature electrical insulation |
| Silicate-Based Adhesive | Approximately 300–700°C, depending on the silicate system and moisture exposure | Approximately 800–1,000°C for selected formulations | Porous ceramics, metals, glass, mineral boards, and refractory materials | Nonflammable, inorganic, economical, and suitable for high-temperature insulation and gap filling | Can be moisture-sensitive before full conversion; typically rigid and less tolerant of shock or joint movement | Refractory repair, kiln insulation, furnace lining, pipe insulation, and fire-resistant assemblies |
| Phosphate-Based Ceramic Adhesive | Approximately 400–1,000°C, depending on filler and formulation | Some systems operate above 1,000°C in rigid, well-supported joints | Alumina, zirconia, silica, glass, graphite, and selected metals | High-temperature ceramic bonding, good dimensional stability, and strong adhesion to many oxide surfaces | Rigid bond line; may be chemically incompatible with certain metals or alkaline materials; joint movement must be minimized | High-temperature sensors, ceramic assemblies, furnace hardware, and refractory component repair |
| High-Temperature Silicone Adhesive | Approximately 180–300°C, depending on grade and continuous exposure duration | Approximately 300–350°C for limited-duration exposure | Glass, coated metals, ceramics, plastics, and painted surfaces with suitable primers | Flexible bond line, excellent vibration damping, good weathering resistance, and tolerance for differential thermal expansion | Lower load-bearing strength than rigid ceramic systems; unsuitable for many extreme-temperature applications above its rated limit | Gaskets, appliance assemblies, electrical enclosures, engine components, and vibration-sensitive joints |